Relying on over 30 years wire bonding knowhow, TPT Wire Bonder GmbH & Co. KG designs and manufactures a complete range of manual and semi automatic wire bonder machines. Wire Bonders such as Automatic Ball Bonders, Manual Wedge Bonders, Wire Bonding, Automatic Wedge Bonders, Manual Ball Bonders.

Wire Bonders manual and semi-automatic ball conder and wedge bonder for open cavity QFN packages, Semiconductor and MEMS.

Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder. The most competitive 4 types:thin aluminum wire wedge bonder (25-75um aluminum wire);Wire wedge bonder (25-125um aluminum wire); heavy aluminum wire wedge bonder(75-500um aluminum wire);gold wire ball bonder (17-50um gold wire).

They are very popular for samll quantity production, school,institution,research department. And the 3 automatic: automatic thin aluminum wire bonder (18-50um aluminum wire); automatic ball bonder (15-50um Au or alloy wire); automatic heavy wire bonder (125-500um Aluminum wire). 1: Thin wire bonder MDB-2575: Application: Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect. Specification: 1,electric requirement:220VAC±10%,50HZ,be sure connected to ground 2,wire diameter:25 ~75μm 3,ultrasonic power:0 -3W, two channel. Can be set separately of the two point 4,bond time:5 -200ms,two channel 5,bond force:10 -60g,two channel 6, span between first bond to second bond by automatic mode:0-10mm(motorized) 7,bond radian: 0-6mm(motorized) 8, jig moving area: Φ16mm 9,mouse hand:20*20mm 10,digital camera: optional 11,dimension:600*560*390mm 12,weight:36kg 2, Wire wedge bonder MDB-25125. Application: Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor etc.

Specification: 1,electric requirement:220VAC±10%,50HZ,be sure connected to ground 2,wire diameter:25~125μm 3,ultrasonic power:0-5W, two channel. Deixem O Pimba. Can be set separately of the two point 4,wire cutting:can set cut or no cut. 5,bond time:10-200ms,two channel 6,bond force:30-1000g,two channel 7, span between first bond to second bond by automatic mode:0-9mm(motorized) 8,bond radian: 0-6mm(motorized) 9, jig moving area: Φ16mm 10,mouse hand:20*20mm 11,digital camera: optional 12,dimension:600*560*390mm;weight:28kg 3:Heavy wire bonder MDB-7550: Application. High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126, TO-12F,TO-66,TO-251,TO-202 etc. Specification: 1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 2,aluminium wire diameter:75~500μm (3~20mil) 3,ultrasonic power:0-30W, two channel.can be set separately of the two point 4,bond time:10-500ms,two channel 5,bond force:30-1200g,two channel 6,motorized Y:0-18mm 7,microscope rate:7.5 and 15 8,working area:Φ25mm 9,light:adjustable brightness 10,size:620×610×560mm 11,weight:~40kg 4:Gold wire ball bonder MDBB-1750. Application: LED, chips, diode, laser tube, the inner lead, semiconductor devices etc. Specification: 1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 2,wire diameter:17~50μm 3,ultrasonic power:0-3W, two channel. Pc Suite Sony Ericsson Vivaz U5i.

Can be set separately of the two point 4,bond time:0-200ms,two channel 5,bond force:35-180g,two channel 6,digital camera systerm:optional 7,min bonding time:0.4s/wire 8,span between first bond to second bond by automatic mode: more than 4mm. 9,length of terminal wire: 0-2mm 10,ball dimension:2-4 times bigger setable 11,bond temperature: house temperature ~ 400°C 12,jig moving area: Φ25mm 13,microscope:15X,30X 14,dimension:700*460*550mm 15,weight:28kg. Guangzhou Minder-Hightech Co.,Ltd(main web page: /www.minder-hightech.com) is focused on connection(welding). We are comprised by a group of high educated specialists,with the leader of overseas professor, some of us have more than 20 years welding experience,our goal is to provide high performance product but low price and exceeded service. We care for the safety of operator, this year, we developed a safety system in spot welding industry named SOFT TOUCH system,which can prevent heavy pinch point injury.

We are specialized in most of the connection(welding) technics,the most application we have participated in are electronic component(resistance,capacitor,inductor),chip on board,automotive electronic accessories,cell phone,IC cards,motor armature commutator etc.By material, we have engaged in connecting the Aluminum, Copper, Brass, Au(gold), Platinum, Nickel, Enameled wire, etc. Moorhuhn Tiger Chicken there. We also provided the full IC package line; and LED producing line; Crystal oscillator producing line; as well as the wafer machining equipment.